| Layer count | 4 - 40+ layers, with various HDI structures such as 1+N+1, 2+N+2, 3+N+3, and ELIC (Every Layer Interconnect) | |||
|---|---|---|---|---|
| Base Material | FR-4, High Tg FR-4, Halogen-free, Rogers, or other high-performance materials | |||
| Board Thickness | 0.2mm - 6.0mm | |||
| Copper Thickness | 0.5 oz - 6 oz (17.5渭m - 210渭m) | |||
| Minimum Hole Size | 0.1mm for mechanically drilled microvias, 0.075mm for laser-drilled microvias聽 | |||
| Minimum Trace/Space Width | 2 mils (50渭m) for standard HDI, down to 1 mil (25渭m) for advanced designs | |||
| Solder Mask | LPI (Liquid Photo-Imageable) in Green, Yellow, White, Black, Blue, Red, and other custom colors | |||
| Silkscreen | White, Black, Yellow, and other custom colors | |||
| Surface Finishes | ENIG, OSP, Immersion Silver, Immersion Tin, HASL | |||
| Blind/Buried Vias | Yes, to enable routing between adjacent or non-adjacent layers | |||
| Minimum Annular Ring | 2 mils (50渭m) for outer layers, 1 mil (25渭m) for inner layers | |||
| Controlled Impedance | Tolerance of 卤10% or better | |||
| Special Features | mbedded or integrated passive components (resistors, capacitors, etc.), rigid-flex designs, back drilling, etc. |
HDI PCB
$125.00
HDI PCB
Layer count: 4 – 40+ layers, with various HDI structures such as 1+N+1, 2+N+2, 3+N+3, and ELIC (Every Layer Interconnect);
Base Material: FR-4, High Tg FR-4, Halogen-free, Rogers, or other high-performance materials;
Request for Quotation
Будьте первым, кто оставил отзыв на “HDI PCB”
Отзывы
Отзывов пока нет.