| Layer count | Single-sided, double-sided, and multilayer (up to 40+ layers) | |||
|---|---|---|---|---|
| Material | Taconic, Isola, PTFE, Arlon, and FR-4 High-Tg | |||
| DK (Dielectric Constant) | 2.0 to 10 (more stable materials are required for high frequencies) | |||
| DF (Dissipation Factor) | Low values, typically <0.005 for high-frequency applications | |||
| Board Thickness | 0.1mm – 6.0mm | |||
| Copper Thickness | 0.5 Oz (17.5 µm) – 5 Oz (175 µm) | |||
| Minimum Trace Width/Spacing | 4mil/4mil (0.1016mm/0.1016mm) or better, depending on design and materials | |||
| Minimum Hole Size | 0.2mm (8mil) – 0.4mm (16mil) or larger, depending on layer count | |||
| Aspect Ratio | 10:1 or better | |||
| Maximum Board Size | 500mm x 1100mm (20" x 44") or larger, varies with layer counts | |||
| Surface Finish | HASL, Lead-Free HASL, ENIG, Immersion Silver, OSP, etc. | |||
| Solder Mask | Green, Blue, Yellow, Black, Red, White, and other colors | |||
| Solder Mask Resolution | 4mil (0.1mm) minimum | |||
| Solder Mask Registration | ±2mil (±0.0508mm) | |||
| Silkscreen Color | White, Black, Yellow | |||
| Plated Through Holes (PTH) | Yes | |||
| Blind & Buried Vias (BBV) | Yes | |||
| Controlled Impedance | Yes, tightly controlled impedance is essential for high-frequency applications | |||
| Electrical Testing | Continuity & isolation, impedance control, Hi-Pot, etc. | |||
| Thermal Management | Required for high-frequency applications, might include thermal vias, heat sinks, and metal cores | |||
| Certification | ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard |
High-Frequency PCB
$115.00
High-Frequency PCB
Layer: Single-sided, double-sided, and multilayer (up to 40+ layers);
Material: Taconic, Isola, PTFE, Arlon, and FR-4 High-Tg;
Certification: ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard;
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